**Product Specifications:**
**Brand:** BIWIN
**Product Line:** SSD
**Selection Guide:**
- Sequential Read Speed
- Sequential Write Speed
- Optional
- Interface Type
- Product Model
- Product Description
- Warranty Period
**BIWIN SSD Products:**
- **X570PRO PCIe 5.0:**
- Capacity: 1TB
- Sequential Read Speed: 14000MB/s
- Sequential Write Speed: 13000MB/s
- TBW: 3000TBW
- Description: Gen5 flagship choice
- **NV7400 PCIe 4.0:**
- Capacity: 4TB
- Sequential Read Speed: 7450MB/s
- Sequential Write Speed: 6500MB/s
- TBW: 4000TBW
- Description: Flagship RGB
- **NV7400HEATSINK:**
- Capacity: 2TB
- Sequential Read Speed: 7400MB/s
- Sequential Write Speed: 6500MB/s
- TBW: 2000TBW
- Description: PCIe 4.0 RGB SSD
- **M350 PCIe 4.0:**
- Capacity: 500GB
- Sequential Read Speed: 7200MB/s
- Sequential Write Speed: 6200MB/s
- TBW: 1600TBW
- Description: Entry-level choice
- **NV3500 PCIe 3.0:**
- Capacity: 2TB
- Sequential Read Speed: 3500MB/s
- Sequential Write Speed: 3000MB/s
- TBW: 1200TBW
- Description: Gen3 flagship choice
- **M100 2.5" SATA 3.0:**
- Capacity: 128GB
- Sequential Read Speed: 550MB/s
- Sequential Write Speed: 500MB/s
- TBW: 640TBW
- Description: Refresh upgrade
**M350 PCIe 4.0 NVMe M.2 SSD:**
- Sequential Read Speed: 6000MB/s
- Sequential Write Speed: 5000MB/s
- Description: System performance upgrade
**M350 PCIe Gen4x4 SSD:**
- Sequential Read Speed: 6000MB/s
- Description: Over 10 times faster than SATA
**Features:**
- HMB Mechanism + SLCCache Intelligent Cache Technology
- Dual Acceleration
- Supports HMB Acceleration Mechanism and SLCCache Dynamic Simulation
**Compatibility:**
- Supports HMB Function + SLCCache
- PCIe Gen3 Interface
- Dual Acceleration Mechanism
**Design:**
- Single-Sided Design
- 2280 M.2 Interface
**Included Software:**
- Acronis True Image Hard Drive Cloning Software
**Packaging Contents:**
- BIWIN PCIe Express M350 SSD
- Screwdriver
- Screws x1
- User Manual
*Note: The above data is based on BIWIN laboratory test results and is for reference only. Actual performance may vary due to interface and device differences.*